Professor of Mechanical Engineering,
Purdue University
Visiting Faculty, Plaksha Tech Leaders Fellowship
Ph.D. & M.S. (Georgia Tech)
B.Tech. (IIT Guwahati)
Dr. Jitesh H. Panchal is a Professor in the School of Mechanical Engineering at Purdue University. Dr. Panchal's research interests are in the science of systems engineering and design, with focus on decision making in decentralized socio-technical systems, secure design and manufacturing, and integrated products and materials design. He is a co-author of two books, and has co-edited one book. He is currently an Associate Editor of the ASME Journal of Mechanical Design.
Research Interests
Computational Design of Socio-Technical Systems
Secure Design and Manufacturing
Engineering Design by Self-Organized Virtual Communities
Integrated Products and Materials Design
Research Area(s)
Design
Manufacturing
Publications:
Dachowicz, A., Chaduvula, S.C., Atallah, M., Panchal, J.H., 2017, "Microstructure-based Counterfeit Detection in Metal Part Manufacturing", JOM: The Journal of the Minerals, Metals & Materials Society, Vol. 69, No. 11, pp. 2390-2396. DOI: 10.1007/s11837-017-2502-8.
Chaitanya, C.S., Atallah, M., and Panchal, J.H., 2018, "Secure Co-design: Achieving Optimality without Revealing," ASME Journal of Computing and Information Science in Engineering, Vol. 18, No. 2, 021007. DOI: 10.1115/1.4039431.
Shergadwala, M., Bilionis, I., Kannan, K., and Panchal, J.H., 2018, "Quantifying the Impact of Domain Knowledge and Problem Framing on Sequential Decisions in Engineering Design", ASME Journal of Mechanical Design, Vol. 140, No. 10, 101402. DOI: 10.1115/1.4040548.
Chaudhari, A.M., Bilionis, I., and Panchal, J.H., 2020, "Descriptive Models of Sequential Decisions in Engineering Design: An Experimental Study," ASME Journal of Mechanical Design, Vol. 142, No. 8, 081704. DOI: 10.1115/1.4045605.
Dachowicz, A., Atallah, M., and Panchal, J.H., 2020, "Extraction and Analysis of Spatial Correlation Micrograph Features for Traceability in Manufacturing," ASME Journal of Computing and Information Science in Engineering, Vol. 20, No. 5, 051004. DOI: 10.1115/1.4046891
Awards: